Materials for printed boards and other interconnecting structures - Part 2-53: Reinforced base materials clad and unclad - PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad
Materials for circuit boards and other interconnecting structures - Part 3-6: Sectional specification set for unreinforced base materials clad and unclad - Polytetrafluoroethylene (PTFE) filled laminate sheets of defined flammability (vertical burning test), copper-clad
Fibre optic communication subsystem test procedures - Part 1-3: General communication subsystems - Measurement of central wavelength, spectral width and additional spectral characteristics
Fibre optic communication subsystem test procedures - Part 1-4: General communication subsystems - Light source encircled flux measurement method
Fibre optic communication subsystem test procedures - Part 2-13: Digital systems - Measurement of error vector magnitude
Fibre optic communication subsystem test procedures - Part 2-8: Digital systems - Determination of low BER using Q-factor measurements
Fibre-optic communication subsystem test procedures - Part 4-1: Installed cabling plant - Multimode attenuation measurement
Fibre-optic communication subsystem test procedures - Part 4-1: Installed cabling plant - Multimode attenuation measurement
Fibre-optic communication subsystem test procedures - Part 4-1: Installed cabling plant - Multimode attenuation measurement
Fibre-optic communication subsystem test procedures - Part 4-1: Installed cabling plant - Multimode attenuation measurement
Fibre-optic communication subsystem test procedures - Part 4-2: Installed cabling plant - Single-mode attenuation and optical return loss measurements
Fibre optic communication subsystem test procedures - Part 4-3: Installed passive optical networks - Attenuation and optical return loss measurements
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