Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
Electric and magnetic field levels generated by AC power systems - Measurement procedures with regard to public exposure
Electric and magnetic field levels generated by AC power systems - Measurement procedures with regard to public exposure
Methods of measurement for minidisc recorders/players
Methods of measurement for consumer-use digital VTRs - Electronic and mechanical performances
Ultrasonics - Hydrophones - Part 2: Calibration for ultrasonic fields up to 40 MHz
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