Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
Double-capped fluorescent lamps - Safety specifications
Double-capped fluorescent lamps - Safety specifications
Double-capped fluorescent lamps - Safety specifications
Coaxial communication cables - Part 10-1: Blank detail specification for semi-rigid cables with polytetrafluoroethylene (PTFE) dielectric
Coaxial communication cables - Part 10: Sectional specification for semi-rigid cables with polytetrafluoroethylene (PTFE) dielectric
Coaxial communication cables - Part 10: Sectional specification for semi-rigid cables with polytetrafluoroethylene (PTFE) dielectric
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