Guide for procurement of power station equipment - Part 6-8: Turbine auxiliaries - Cranes
Aerospace series - Modular and Open Avionics Architectures - Part 004: Packaging
Sound system equipment: Headphones and earphones associated with personal music players - Maximum sound pressure level measurement methodology - Part 1: General method for "one package equipment"
Sound system equipment: Headphones and earphones associated with personal music players - Maximum sound pressure level measurement methodology - Part 2: Matching of sets with headphones if either or both are offered separately, or are offered as one package equipment but with standardised connectors between the two allowing to combine components of different manufacturers or different design
Collection, logistics & Treatment requirements for WEEE - Part 1: General treatment requirements
Collection, logistics and treatment requirements for WEEE - Part 2-1: Treatment requirements for lamps
Collection, logistics & Treatment requirements for WEEE - Part 2-2: Treatment requirements for WEEE containing CRTs and flat panel displays
Collection, logistics & treatment requirements for WEEE - Part 2-3: Treatment requirements for temperature exchange equipment and other WEEE containing VFC and/or VHC
Collection, logistics & treatment requirements for WEEE - Part 2-4: Treatment requirements for photovoltaic panels
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
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