Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
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