Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
Packaging of winding wires - Part 1: Containers for round winding wires
Packaging of winding wires - Part 1: Containers for round winding wires
Packaging of winding wires - Part 2-1: Cylindrical barrelled delivery spools - Basic dimensions
Packaging of winding wires - Part 2-1: Cylindrical barrelled delivery spools - Basic dimensions
Packaging of winding wires - Part 2-2: Cylindrical barrelled delivery spools - Specification for returnable spools made from thermoplastic material
Packaging of winding wires - Part 2-2: Cylindrical barrelled delivery spools - Specification for returnable spools made from thermoplastic material
Packaging of winding wires - Part 2-3: Cylindrical barrelled delivery spools - Specification for non-returnable spools made from thermoplastic material
Packaging of winding wires - Part 2-3: Cylindrical barrelled delivery spools - Specification for non-returnable spools made from thermoplastic material
Packaging of winding wires - Part 3-1: Taper barrelled delivery spools - Basic dimensions
53,361 afzonderlijke normreferenties geïndexeerd op basis van vastgelegde officiële bronnen. Eerdere edities zijn inbegrepen. De index en de collecties van uitgevers hebben een verschillende dekking. Zie bronnen en dekking.