Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method
Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 1: General conditions and definitions
Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 1: General conditions and definitions
Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 3: Bulk current injection (BCI) method
Fibre optic active components and devices - Package and interface standards - Part 11: 14-pin modulator-integrated laser diode transmitters
Fibre optic active components and devices - Performance standards - Part 3: 2,5 Gbit/s modulator-integrated laser diode transmitters
Fibre optic active components and devices - Performance standards - Part 3: Modulator-integrated laser diode transmitters for 2,5-Gbit/s to 40-Gbit/s fibre optic transmission systems
EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)
Identification card systems - Telecommunications integrated circuit(s) cards and terminals - Part 1: Systems overview
Identification card systems - Telecommunications integrated circuit(s) cards and terminals - Part 2: Security framework
Identification card systems - Telecommunications integrated circuit(s) cards and terminals - Part 3: Application independent card requirements
Identification card systems - Telecommunications integrated circuit(s) cards and terminals - Part 4: Application independent card related terminal requirements
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