Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
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