Discharge lamps (excluding fluorescent lamps) - Safety specifications
Discharge lamps (excluding fluorescent lamps) - Safety specifications
Passive RF and microwave devices, intermodulation level measurement - Part 4: Measurement of passive intermodulation in coaxial cables
Passive RF and microwave devices, intermodulation level measurement - Part 4: Measurement of passive intermodulation in coaxial cables
Uninterruptible power systems (UPS) - Part 4: Environmental aspects - Requirements and reporting
Uninterruptible power systems (UPS) - Part 5-3: DC output UPS - Performance and test requirements
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods
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