Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
Fibre optic active components and devices - Test and measurement procedures - Part 1: General and guidance
Fibre optic active components and devices - Test and measurement procedures - Part 2: ATM-PON transceivers
Fibre optic active components and devices - Test and measurement procedures - Part 3: Optical power variation induced by mechanical disturbance in optical receptacles and transceiver interfaces
Fibre optic active components and devices - Test and measurement procedures - Part 4: Relative intensity noise using a time-domain optical detection system
Fibre optic active components and devices - Test and measurement procedures - Part 5: Wavelength channel tuning time of tuneable transmitters
Metallic communication cables test methods - Part 1-1: Electrical - Measurement of the pulse/step return loss in the frequency domain using the Inverse Discrete Fourier Transformation (IDFT)
Metallic communication cables test methods - Part 4-2: Electromagnetic compatibility (EMC) - Screening and coupling attenuation - Injection clamp method
Polymeric HV insulators for indoor and outdoor use - General definitions, test methods and acceptance criteria
Electric cables - Spark-test method
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