Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
Fibre optic active components and devices - Package and interface standards - Part 11: 14-pin active device modules
Fibre optic active components and devices - Package and interface standards - Part 12: Laser transmitters with coaxial RF connector
Fibre optic active components and devices - Package and interface standards - Part 12: Laser transmitters with a coaxial RF connector
Fibre optic active components and devices - Package and interface standards - Part 16: Transmitter and receiver components for use with LC connector interface
Fibre optic active components and devices - Package and interface standards - Part 18: 40-Gbit/s serial transmitter and receiver components for use with the LC connector interface
Fibre optic active components and devices - Package and interface standards - Part 2: SFF 10-pin transceivers
Fibre optic active components and devices - Package and interface standards - Part 2: SFF 10-pin transceivers
Fibre optic active components and devices - Package and interface standards - Part 3: SFF 20-pin transceivers
Fibre optic active components and devices - Package and interface standards - Part 3: SFF 20-pin transceivers
Fibre optic active components and devices - Package and interface standards - Part 5: SC 1x9 fibre optic modules
Materials and articles in contact with foodstuffs - Catering containers - Part 1: Dimensions of containers
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