Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Environmental testing - Part 2-85: Tests - Test Fj: Vibration - Long time history replication
Environmental testing - Part 2-86: Tests - Test Fx: Vibration - Multi-exciter and multi-axis method
Environmental testing - Part 2-87: Tests - UV-C exposure of materials and components to simulate ultraviolet germicidal Irradiation or other applications
Environmental testing - Part 2-88: Tests – Test XD: Resistance of components and assemblies to liquid cleaning media
Environmental testing - Part 3-14: Supporting documentation and guidance - Developing a climatic sequential test
Environmental testing - Part 3-1: Supporting documentation and guidance - Cold and dry heat tests
Environmental testing - Part 3-3: Supporting documentation and guidance - Seismic test methods for equipment
Environmental testing - Part 3-3: Supporting documentation and guidance - Seismic test methods for equipment
Environmental testing - Part 3-4: Supporting documentation and guidance - Damp heat tests
Environmental testing - Part 3-5: Supporting documentation and guidance - Confirmation of the performance of temperature chambers
Environmental testing - Part 3-6: Supporting documentation and guidance - Confirmation of the performance of temperature/humidity chambers
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