Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages
Fibre optic active components and devices - Package and interface standards - Part 17: Transmitter and receiver components with dual coaxial RF connectors
Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package
Fibre optic active components and devices - Package and interface standards - Part 1: General and guidance
Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
Fibre optic active components and devices - Package and interface standards - Part 22: 25 Gbit/s directly modulated laser packages with temperature control unit
Fibre optic active components and devices - Package and interface standards - Part 6: ATM-PON transceivers
Fibre optic active components and devices - Performance standards - Part 10: Radio-over-fibre (RoF) transceivers for mobile fronthaul
Fibre optic active components and devices - Performance standards - Part 11: Multiple channel transmitter/receiver chip scale package with multimode fibre interface
Fibre optic active components and devices - Performance standards - Part 12: Distributed feedback laser diode device for analogue radio over fibre systems
Fibre optic active components and devices - Performance standards - Part 3: Modulator-integrated laser diode transmitters for 40-Gbit/s fibre optic transmission systems
Fibre optic active components and devices - Performance standards - Part 4: 1 300 nm fibre optic transceivers for Gigabit Ethernet application
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