Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
Electricity metering equipment (a.c.) - General requirements, tests and test conditions - Part 21: Tariff and load control equipment
Electricity metering equipment (AC) - General requirements, tests and test conditions - Part 21: Tariff and load control equipment
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