Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Synthetic organic esters - Guidelines for maintenance and use in electrical equipment
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