Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
Packaging of winding wires - Part 1: Containers for round winding wires
Packaging of winding wires - Part 1: Containers for round winding wires
Packaging of winding wires - Part 2-1: Cylindrical barrelled delivery spools - Basic dimensions
Packaging of winding wires - Part 2-1: Cylindrical barrelled delivery spools - Basic dimensions
Packaging of winding wires - Part 2-2: Cylindrical barrelled delivery spools - Specification for returnable spools made from thermoplastic material
Packaging of winding wires - Part 2-2: Cylindrical barrelled delivery spools - Specification for returnable spools made from thermoplastic material
Packaging of winding wires - Part 2-3: Cylindrical barrelled delivery spools - Specification for non-returnable spools made from thermoplastic material
Packaging of winding wires - Part 2-3: Cylindrical barrelled delivery spools - Specification for non-returnable spools made from thermoplastic material
Packaging of winding wires - Part 3-1: Taper barrelled delivery spools - Basic dimensions
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