Specification for non-impregnated, densified laminated wood for electrical purposes - Part 2: Methods of test
Specification for non-impregnated, densified laminated wood for electrical purposes - Part 2: Methods of test
Non-impregnated densified laminated wood for electrical purposes - Part 3: Specifications for individual materials - Sheet 1: Sheets produced from beech veneer
Non-impregnated densified laminated wood for electrical purposes - Part 3: Specifications for individual materials - Sheet 2: Rings produced from beech veneer
Connectors for use in d.c., low-frequency analogue and digital high speed data applications - Part 3-100: Rectangular connectors with assessed quality - Detail specification for a range of shielded connectors with trapezoidal-shaped shells and non-removable ribbon contacts on a 1,27 mm double row
Connectors with assessed quality, for use in d.c. low-frequency analogue and in digital high-speed data applications - Part 3: Rectangular connectors - Section 101: Detail specification for a range of shielded connectors with trapezoidal shaped shells and non-removable rectangular contacts on a 1,27 mm x 2,54 mm centre-line
Connectors for electronic equipment - Part 3-103: Rectangular connectors - Detail specification for single row connectors with non-removable ribbon cable contacts on 1,25 mm pitch used for high speed serial data (HSSDC)
Connectors for electronic equipment - Part 4-107: Printed board connectors with assessed quality - Detail specification for shielded two-part connectors having a basic grid of 2,0 mm, fixed part with solder and press-in terminations for printed boards, free part with non-accessible insulation displacement and crimp terminations
Video cameras (PAL/SECAM/NTSC) - Methods of measurement - Part 1: Non-broadcast single-sensor cameras
Video cameras (PAL/SECAM/NTSC) - Methods of measurement - Part 3: Non-broadcast camera-recorders
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
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