Metallic communication cables test methods - Part 1-1: Electrical - Measurement of the pulse/step return loss in the frequency domain using the Inverse Discrete Fourier Transformation (IDFT)
Metallic communication cables test methods - Part 4-2: Electromagnetic compatibility (EMC) - Screening and coupling attenuation - Injection clamp method
High-voltage switchgear and controlgear - Part 211: Direct connection between power transformers and gas-insulated metal-enclosed switchgear for rated voltages above 52 kV
High-voltage switchgear and controlgear - Part 211: Direct connection between power transformers and gas-insulated metal-enclosed switchgear for rated voltages above 52 kV
High-voltage switchgear and controlgear - Part 211: Direct connection between power transformers and gas-insulated metal-enclosed switchgear for rated voltages above 52 kV
Determination of certain substances in electrotechnical products - Part 4: Mercury in polymers, metals and electronics by CV-AAS, CV-AFS, ICP-OES and ICP-MS
Determination of certain substances in electrotechnical products - Part 4: Mercury in polymers, metals and electronics by CV-AAS, CV-AFS, ICP-OES and ICP-MS
Determination of certain substances in electrotechnical products - Part 5: Cadmium, lead and chromium in polymers and electronics and cadmium and lead in metals by AAS, AFS, ICP-OES and ICP-MS
Determination of certain substances in electrotechnical products - Part 7-1: Hexavalent chromium - Presence of hexavalent chromium (Cr(VI)) in colorless and colored corrosion-protected coatings on metals by the colorimetric method
Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET)
Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
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