Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
Materials for printed boards and other interconnecting structures - Part 2-52: Reinforced base materials clad and unclad - Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad
Materials for printed boards and other interconnecting structures - Part 2-53: Reinforced base materials clad and unclad - PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad
Materials for circuit boards and other interconnecting structures - Part 3-6: Sectional specification set for unreinforced base materials clad and unclad - Polytetrafluoroethylene (PTFE) filled laminate sheets of defined flammability (vertical burning test), copper-clad
Materials for printed boards and other interconnecting structures - Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from "E" glass for printed boards
Controlgear for electric light sources - Safety - Part 2-1: Particular requirements - Starting devices (other than glow starters)
Secondary cells and batteries containing alkaline or other non-acid electrolytes - Secondary lithium cells and batteries for portable applications - Part 4: Coin secondary lithium cells, and batteries made from them
Secondary cells and batteries containing alkaline or other non-acid electrolytes - Secondary lithium cells and batteries for portable applications - Part 4: Coin secondary lithium cells, and batteries made from them
Secondary cells and batteries containing alkaline or other non-acid electrolytes - Safety requirements for portable sealed secondary cells, and for batteries made from them, for use in portable applications - Part 1: Nickel systems
Metallic cables and other passive components test methods - Part 4-15: Electromagnetic compatibility (EMC) - Test method for measuring transfer impedance and screening attenuation - or coupling attenuation with triaxial cell
Metallic cables and other passive components test methods - Part 4-15: Electromagnetic compatibility (EMC) related test method for measuring transfer impedance and screening attenuation or coupling attenuation with triaxial cell
Metallic cables and other passive components test methods - Part 4-16: Electromagnetic compatibility (EMC) - Extension of the frequency range to higher frequencies for transfer impedance and to lower frequencies for screening attenuation measurements using the triaxial set-up
53,361 distinct reference strings indexed from official source snapshots. Includes earlier editions. The index and publisher collections have different coverage. See sources and coverage.