High-voltage switchgear and controlgear - Part 211: Direct connection between power transformers and gas-insulated metal-enclosed switchgear for rated voltages above 52 kV
Determination of certain substances in electrotechnical products - Part 4: Mercury in polymers, metals and electronics by CV-AAS, CV-AFS, ICP-OES and ICP-MS
Determination of certain substances in electrotechnical products - Part 4: Mercury in polymers, metals and electronics by CV-AAS, CV-AFS, ICP-OES and ICP-MS
Determination of certain substances in electrotechnical products - Part 5: Cadmium, lead and chromium in polymers and electronics and cadmium and lead in metals by AAS, AFS, ICP-OES and ICP-MS
Determination of certain substances in electrotechnical products - Part 7-1: Hexavalent chromium - Presence of hexavalent chromium (Cr(VI)) in colorless and colored corrosion-protected coatings on metals by the colorimetric method
Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET)
Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
Semiconductor devices - Metallization stress void test
Secondary cells and batteries containing alkaline or other non-acid electrolytes - Sealed nickel-metal hydride prismatic rechargeable single cells
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
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