Connectors for electronic equipment - Product requirements - Part 3-110: Detail specification for shielded, free and fixed connectors for data transmission with frequencies up to 1 000 MHz
Connectors for use in d.c., low-frequency analogue and digital high-speed data applications - Part 3: Rectangular connectors with assessed quality - Sectional specification
Connectors with assessed quality, for use in d.c., low frequency analogue and in digital high-speed data applications - Part 4: Printed board connectors - Section 100: Detail specification for two-part connector modules having a grid of 2,5 mm (0,098 in) for printed boards and backplanes
Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high-speed data applications - Part 4: Printed board connectors - Section 101: Detail specification for two-part connector modules having a basic grid of 2,0 mm for printed boards and backplanes in accordance with IEC 60917
Connectors for use in d.c., low-frequency analogue and digital high-speed data applications - Part 5: In-line sockets with assessed quality - Sectional Specification
Data exchange for meter reading, tariff and load control - Direct local data exchange
Data exchange for meter reading, tariff and load control - Direct local data exchange
Data exchange for meter reading, tariff and load control - Local bus data exchange
Data exchange for meter reading, tariff and load control - Local bus data exchange
Digital data communications for measurement and control - Fieldbus for use in industrial control systems - Part 2: Physical layer specification and service definition
Industrial communication networks - Fieldbus specifications - Part 3-12: Data-link layer service definition - Type 12 elements
Industrial communication networks - Fieldbus specifications - Part 3-12: Data-link layer service definition - Type 12 elements
53,361 distinct reference strings indexed from official source snapshots. Includes earlier editions. The index and publisher collections have different coverage. See sources and coverage.