Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
Fibre optic connector interfaces - Part 21: Type SMI connector family for plastic optical fibre
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines
Railway applications - Rolling stock equipment - Capacitors for power electronics - Part 1: Paper/plastic film capacitors
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures
Polymeric HV insulators for indoor and outdoor use - General definitions, test methods and acceptance criteria
Consumer audio/video equipment digital interface with plastic optical fibre
Polymeric thermistors - Directly heated positive step function temperature coefficient - Part 1-1: Blank detail specification - Current limiting application
Polymeric thermistors - Directly heated positive step function temperature coefficient - Part 1: Generic specification
Determination of certain substances in electrotechnical products - Part 3-2: Screening - Total bromine in polymers and electronics by Combustion - Ion Chromatography
53,361 distinct reference strings indexed from official source snapshots. Includes earlier editions. The index and publisher collections have different coverage. See sources and coverage.