Reference details
- Reference
- EN 62047-13:2012
- Official title
- Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures
- Organisation
- CENELEC
- Publisher status in source
- PublishedThis is the status recorded in the source, not a statement that this is the latest edition.
- Source access
- 19 October 2026
Research and application
Begin with the official scope and the product configuration. The title identifies a subject; it does not establish every product, use condition or legal requirement covered by the publication.
Product research routes
- Measurement, test and laboratory equipment
Measurement function, accuracy claims, electrical safety and the conditions under which results are comparable.
- Chemicals, plastics and rubber
Substance identity, material properties, sampling and analytical methods across chemical and polymer products.
Questions for the evidence file
- Measurement model
- Uncertainty budget
- Calibration traceability
- Environmental and sample conditions
- Substance and formulation identity
- Sample preparation
Record the exact edition and associated amendments, the assessed object, the evidence examined and the limits of the conclusion. Explore IESQ research for detailed product and standard studies.
Legal citation
No Commission citation record has been linked to this reference in the IESQ index. That is an index result, not a conclusion that the standard is uncited. Consult the relevant Commission list and Official Journal acts.
Browse legislation reference lists →