Reference details
- Reference
- EN 60191-4:2014/A1:2018
- Official title
- Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
- Organisation
- CENELEC
- Publisher status in source
- PublishedThis is the status recorded in the source, not a statement that this is the latest edition.
- Source access
- 19 October 2026
Research and application
Begin with the official scope and the product configuration. The title identifies a subject; it does not establish every product, use condition or legal requirement covered by the publication.
Product research routes
- Packaging, logistics and handling equipment
Protection, transport conditions, package systems and equipment interfaces throughout distribution.
Questions for the evidence file
- Package-and-content configuration
- Distribution assumptions
- Conditioning and test sequence
- Handling instructions
Record the exact edition and associated amendments, the assessed object, the evidence examined and the limits of the conclusion. Explore IESQ research for detailed product and standard studies.
Legal citation
No Commission citation record has been linked to this reference in the IESQ index. That is an index result, not a conclusion that the standard is uncited. Consult the relevant Commission list and Official Journal acts.
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