Reference details
- Reference
- EN IEC 60749-20-1:2026
- Official title
- Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
- Organisation
- CENELEC
- Publisher status in source
- PublishedThis is the status recorded in the source, not a statement that this is the latest edition.
- Source access
- 19 October 2026
Research and application
Begin with the official scope and the product configuration. The title identifies a subject; it does not establish every product, use condition or legal requirement covered by the publication.
Product research routes
- Marine, aviation and aerospace products
Equipment qualification and interface requirements in marine and aerospace service environments.
Questions for the evidence file
- Configuration and installation basis
- Environmental qualification
- Material and process traceability
- Approval scope
Record the exact edition and associated amendments, the assessed object, the evidence examined and the limits of the conclusion. Explore IESQ research for detailed product and standard studies.
Legal citation
No Commission citation record has been linked to this reference in the IESQ index. That is an index result, not a conclusion that the standard is uncited. Consult the relevant Commission list and Official Journal acts.
Browse legislation reference lists →