Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
Electric and magnetic field levels generated by AC power systems - Measurement procedures with regard to public exposure
Electric and magnetic field levels generated by AC power systems - Measurement procedures with regard to public exposure
Methods of measurement for minidisc recorders/players
Methods of measurement for consumer-use digital VTRs - Electronic and mechanical performances
Ultrasonics - Hydrophones - Part 2: Calibration for ultrasonic fields up to 40 MHz
53,361 distinct reference strings indexed from official source snapshots. Includes earlier editions. The index and publisher collections have different coverage. See sources and coverage.