Reference details
- Reference
- EN 62047-25:2016
- Official title
- Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
- Organisation
- CENELEC
- Publisher status in source
- PublishedThis is the status recorded in the source, not a statement that this is the latest edition.
- Source access
- 19 October 2026
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