Reference details
- Reference
- EN 60191-6-18:2010
- Official title
- Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
- Organisation
- CENELEC
- Publisher status in source
- PublishedThis is the status recorded in the source, not a statement that this is the latest edition.
- Source access
- 19 October 2026
Research and application
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Product research routes
- Packaging, logistics and handling equipment
Protection, transport conditions, package systems and equipment interfaces throughout distribution.
Questions for the evidence file
- Package-and-content configuration
- Distribution assumptions
- Conditioning and test sequence
- Handling instructions
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Legal citation
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